ON Semiconductor Introduces High Performance Field Stop IGBTs for High Efficiency Power Conversion

Tuesday May 8th 2012 03:00:00 AM

Power Conversion Intelligent Motion (PCIM), NUREMBERG, Germany – May 8, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, today introduced a new series of Field Stop Insulated Gate Bipolar Transistors (IGBTs) targeted at industrial motor control and consumer products. The NGTB15N120, NGTB20N120 and NGTB25N120 enable high performance power conversion solutions for a wide range of demanding applications, including induction cook tops, rice cookers and other small kitchen appliances.

ON Semiconductor Offers Intelligent Power Modules by Combining Its Power Expertise and Insulated Metal Substrate Technology

Tuesday May 8th 2012 03:00:00 AM

Power Conversion Intelligent Motion (PCIM), NUREMBERG, Germany – May 8, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, is demonstrating its Intelligent Power Modules (IPM) at this year’s PCIM show in Europe. Experts will be on hand at the company’s booth to discuss its technology, design support and manufacturing capabilities.

By combining the company’s Insulated Metal Substrate Technology (IMST) with its broad power solutions portfolio and longstanding expertise in efficient power management, ON Semiconductor provides an innovative range of Intelligent Power Modules and power inverters as well as design support and manufacturing capability. These IPM solutions cost-effectively address power applications in white goods, solar power and electric hybrid vehicles.

ON Semiconductor’s extensive portfolio of high efficiency power modules range from 300 watts (W) to 5 kilowatts (kW), allowing an unrivalled breadth of customer applications to be addressed, including inverters, boost drivers and motor drivers. With a compact design and footprint that integrates a range of built-in features and intelligent functionality, customers can simplify design, conserve board space, improve reliability, and reduce both component count and overall costs for their end-products.

“Leveraging our experience and expertise in the design and manufacture of advanced discrete power components, and applying the IMST technology gained through ON Semiconductor’s acquisition of SANYO Semiconductor gives us a unique strength in the power module market,” said Eiju Maehara, Hybrid IC division general manager of ON Semiconductor’s SANYO division. “Our extensive range of products and capabilities in this sector will help us to meet the challenges encountered by our customers with innovative, intelligent, and highly integrated solutions.”

For more information about the company’s Hybrid IC technologies, please visit http://semicon.sanyo.com/en/hybrid/.

PCIM - ON Semiconductor Booth - Hall 12, Stand No. 371
ON Semiconductor will be featuring live product presentations for power modules and discrete IGBTs for induction heating, efficient motor drive and solar inverters at PCIM from May 5 – 8 at Stand #371 in Hall 12 of the Exhibition Centre Nuremberg.

Presentation: Bruno Damien, ON Semiconductor’s sales director EMEA for Renewable Energy, will present a paper at PCIM entitled: ‘New Hybrid Technology for Solar Inverters and more Applications’, on May 9 at 16.00.

ON Semiconductor Reports First Quarter 2012 Results

Wednesday May 2nd 2012 03:00:00 AM

For the first quarter of 2012, highlights include:

•Total revenues of $744.4 million
•GAAP and non-GAAP gross margin of 32.9 percent
• GAAP net income per fully diluted share of $0.06
•Non-GAAP net income per fully diluted share of $0.12

PHOENIX, Ariz. – May 2, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN) today announced that total revenues in the first quarter of 2012 were $744.4 million, a decrease of approximately 3 percent from the fourth quarter of 2011. During the first quarter of 2012, the company reported GAAP net income of $28.2 million, or $0.06 per fully diluted share. The first quarter 2012 GAAP net income was impacted by $29.3 million of special items which include restructuring charges and other items. The complete special item details can be found in the attached schedules.

ON Semiconductor to Announce First-Quarter Financial Results

Monday April 23rd 2012 03:00:00 AM

PHOENIX, Ariz. – April 23, 2011 – ON Semiconductor Corporation (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, plans to announce its financial results for the first quarter ending March 30, 2012, after the market closes on Wednesday, May 2, 2012.

The company will host a conference call at 4:30 p.m. Eastern Time (ET) on May 2, following the release of its financial results. Investors and interested parties can access the conference call in the following manner:

• Webcast: A live webcast of the conference call will be available via the “Investors” section of the company’s website at http://www.onsemi.com. The re-broadcast of the call will be available at this site approximately one hour following the live broadcast and will continue for 30 days.

• Teleconference: A telephone conference of the earnings report can be accessed by dialing 888-546-9664 (U.S./Canada) or 973-935-8144 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 74337898.

• Teleconference Replay: Approximately one hour following the live broadcast, the company will provide a dial-in replay that will continue to be available through May 9, 2012. To listen to the teleconference replay, call 855-859-2056 (U.S./Canada) or 404-537-3406 (International). You will be required to provide the Conference ID Number – which is 74337898.

ON Semiconductor Introduces Integrated Switching Buck Regulators with Industry Leading Conversion Ratios

Monday April 23rd 2012 03:00:00 AM

PHOENIX, Ariz. – Apr. 23, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has introduced a new series of switching buck regulators for space-constrained, electromagnetic compatibility (EMC) sensitive automotive entertainment and infotainment applications. These highly integrated devices offer industry leading conversion ratios for battery connected switch-mode power supplies.

NXP and ON Semiconductor to Offer New KNX Evaluation Board for Power Efficient Design of Twisted Pair Building Automation Networks

Thursday April 19th 2012 03:00:00 AM

Light + Building 2012 – FRANKFURT, Germany – April 19, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance, energy efficient silicon solutions, and NXP Semiconductors N.V. (Nasdaq: NXPI) have introduced an evaluation board and complete reference design for power efficient Twisted Pair (TP) networks. The evaluation board, which will be available in May, is undergoing the final phases of formal KNX certification.

ON Semiconductor Announces Retirement of its Zero Coupon Convertible Senior Subordinated Notes Due 2024

Monday April 16th 2012 03:00:00 AM

PHOENIX, Ariz. – April 16, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN) today announced the retirement of $96.2 million in aggregate principal amount of its remaining outstanding Zero Coupon Convertible Senior Subordinated Notes due 2024, Series B (CUSIP No. 682189AE5) (the "Notes"). ON Semiconductor has redeemed approximately $96.2 million in principal amount of the Notes at par using available liquidity.

“We are pleased to announce the retirement of approximately $96.2 million of ON Semiconductor’s Zero Coupon Convertible Senior Subordinated Notes,” said Donald Colvin, ON Semiconductor executive vice president and CFO. “With this redemption, ON Semiconductor will eliminate future potential share dilution associated with the Notes.”

This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical facts, included or incorporated in this document could be deemed forward-looking statements, particularly statements about the future financial performance of ON Semiconductor. These forward-looking statements are often characterized by the use of words such as “believes,” “estimates,” “expects,” “projects,” “may,” “will,” “intends,” “plans,” or “anticipates,” or by discussions of strategy, plans or intentions. All forward-looking statements in this document are made based on information available to us as of the date of this release, our current expectations, forecasts and assumptions, and involve risks, uncertainties and other factors that could cause results or events to differ materially from those expressed in the forward-looking statements. Among these factors are our revenues and operating performance, poor economic conditions and markets (including current credit and financial conditions), effects of exchange rate fluctuations, the cyclical nature of the semiconductor industry, changes in demand for our products, changes in inventories at our customers and distributors, technological and product development risks, enforcement and protection of our intellectual property rights and related risks, availability of raw materials, electricity, gas, water and other supply chain uncertainties, our ability to effectively shift production to other facilities in order to maintain supply continuity for our customers, variable demand and the aggressive pricing environment for semiconductor products, our ability to successfully manufacture in increasing volumes on a cost-effective basis and with acceptable quality for our current products, competitors’ actions including the adverse impact of competitive product announcements, pricing and gross profit pressures, loss of key customers, order cancellations or reduced bookings, changes in manufacturing yields, control of costs and expenses and realization of cost savings from restructurings and synergies, significant litigation, risks associated with decisions to expend cash reserves for various uses such as debt prepayment or acquisitions rather than to retain such cash for future needs, risks associated with acquisitions and dispositions (including from integrating and consolidating, and timely filing financial information with the Securities and Exchange Commission for, recently acquired businesses, such as SANYO Semiconductor, and difficulties encountered in accurately predicting the future financial performance of recently acquired businesses, such as SANYO Semiconductor), risks associated with our substantial leverage and restrictive covenants in our debt agreements from time to time, risks associated with our worldwide operations including foreign employment and labor matters associated with unions and collective bargaining arrangements as well as man-made and/or natural disasters such as the flooding in Thailand or the Japan earthquake and tsunami affecting our operations and finances/financials, the threat or occurrence of international armed conflict and terrorist activities both in the United States and internationally, risks and costs associated with increased and new regulation of corporate governance and disclosure standards (including pursuant to Section 404 of the Sarbanes-Oxley Act of 2002), risks related to new legal requirements and risks involving environmental or other governmental regulation. Information concerning additional factors that could cause results to differ materially from those projected in the forward-looking statements is contained in ON Semiconductor’s Annual Report on Form 10-K for the period ended December 31, 2011, Quarterly Reports on Form 10-Q, Current Reports on Form 8-K and other of our filings with the Securities and Exchange Commission. If any of these trends, risks or uncertainties actually occurs or continues, our business, financial condition or operating results could be materially adversely affected, the trading prices of our securities could decline, and investors could lose all or part of their investment. Readers are cautioned not to place undue reliance on forward-looking statements. These forward-looking statements should not be relied upon as representing our views as of any subsequent date and we do not undertake any obligation to update forward-looking statements to reflect events or circumstances after the date they were made.

ON Semiconductor to Jointly Develop Next Generation Star Tracker CMOS Image Sensor with the European Space Agency

Thursday April 5th 2012 03:00:00 AM

PHOENIX, Ariz. and Noordwijk, Netherlands – April 5, 2012 - ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics today announced that the European Space Agency (ESA) has awarded it a joint development contract for the next generation star tracker CMOS Image Sensor (CIS), referred to as HAS3.

Once developed and qualified, the High Accuracy Star Tracker 3 (HAS3) image sensor will expand the STAR family of radiation-tolerant CIS. The existing HAS2 CIS offered today by ON Semiconductor is designed for Attitude and Orbit Control (AOCS) space applications. The HAS2 was developed and qualified under the General Support Technology Programme of the ESA. The device features an array of 1024 x 1024 active pixels (18 µm) and supports on-chip non-destructive readout and multiple windowing. Following its successful qualification in 2007, ON Semiconductor’s HAS2 image sensor has become the heart of a new generation of Star Trackers which have become the defacto industry standard.

The HAS3 next generation CIS to be jointly developed by ON Semiconductor and the ESA is expected to provide advanced sensor technology. The HAS3 will be a 1280 x 1280 pixel, radiation tolerant CMOS image sensor that features low read noise, 11 x 11 µm2 pixels having 14 bit performance. The HAS3 sensor will support multiple windowing, will be made available in a fully hermetic sealed package and has the option for backside illumination. Applications for the HAS3 device will include star trackers, sun sensors and other scientific applications.

HAS2 Supply

When in July 2011, the silicon supplier producing the HAS2 wafers for ON Semiconductor announced that they would be discontinuing manufacture of this product, ON Semiconductor followed industry Product Change Notification procedures and put its HAS2 image sensor on a “Last Time Buy Status”. Where applicable, special arrangements have been made with existing customers to minimize the impact of this status change. In addition, ON Semiconductor has secured ample product inventory to supply this product to customers to service their predicted full lifetime needs. The company has been actively working with the ESA to perform systematic lot testing to assure HAS2 availability for the years to come. After this period, it is expected that the next generation HAS3 being jointly developed with the ESA will equip a new generation of APS Star Tracker.

“New product technology development and long term support for existing programs demonstrates ON Semiconductor’s commitment to the unique demands of the aerospace business,” said Vince Hopkin, vice president of Digital, Mil/Aero and CMOS Image Sensor Products at ON Semiconductor. “The company recognized that the HAS2 image sensor is a key component in multi-million dollar programs for which no acceptable replacement exists today for our customers. To support our customers and partners, the company made the decision and financial investment to secure sufficient wafer inventory to cover both our existing order backlog and the potential future demand for these HAS2 products from Plessey. We are proud to be a part of the ongoing development of advance image sensor technology supporting the aerospace market.”

According to Stephen Airey of the ESA’s Control Systems Division, “ESA have been working diligently with ON Semiconductor to secure and maintain the supply of the HAS2 image sensor. We are very pleased with the level of procured wafer stock and are convinced that this is more than sufficient for the foreseeable future. ESA is looking forward to the continued collaboration with ON Semiconductor to monitor and safeguard the supply of these components while simultaneously developing the next generation products.”

In case of any questions related to the specifications and/or availability of the HAS2 image sensor, please contact your local ON Semiconductor sales office or Customer Service representative.

ON Semiconductor Supports Next Generation High-Speed Interfaces with Low Quiescent Current 4- and 6-Channel Switches

Tuesday March 27th 2012 03:00:00 AM

PHOENIX, Ariz. – March 27, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics has introduced two new multiple-channel differential switching ICs in single pole, double throw (SPDT) switch configurations for high frequency signals such as PCI Express 3.0 and DisplayPort 1.2 I/O signals. Target applications include notebook computers, desktop computers, servers and network storage equipment.

The NCN3612B is a 6-channel differential SPDT switch that supports 8 gigabits per second (Gbps) data transfer due to its high bandwidth. It has an on-state capacitance (CON) of 2.1 pF (typical) and an on-state resistance (RDSON) of 8 ohms (Ω) (typical). This is complemented by the NCN3411, which is a 4-channel differential switch also capable of supporting 8 Gbps operation. It has a CON of 2 pF (typical) and a RDSON of 7.5 Ω (typical). These attributes make the two new devices highly suited to routing PCI Express 3.0 and DisplayPort 1.2 I/O signals.

“Because of their intrinsically low CON and RDSON figures, the NCN3612B and NCN3411 offer both faster data edge rates and lower insertion losses,” said Thibault Kassir, director for Interface and Power Products at ON Semiconductor. “As a result, these devices deliver the signal integrity levels needed to support the latest high-speed interface standards now being specified for system designs.”

The NCN3612B has a power supply voltage range of 3 volts (V) to 3.6 V and draws a supply current of just 250 microamps (µA) (typical), while the NCN3411 has a power supply voltage range of 1.5 V to 2.0 V and draws a supply current of 200 µA. These new devices have an operational ambient temperature range of −40 °C to +85 °C.

Packaging and Pricing

The NCN3612B is offered in a Pb-free, 56-pin WQFN (5 mm x 11 mm x 0.75 mm) package and is priced at $1.30 per unit in 2,000 unit quantities. The NCN3411 is offered in a Pb-free, 42-pin WQFN (3.5 mm x 9 mm x 0.75 mm) package and is priced at $1.15 per unit in 2,000 unit quantities.

Two New Members Named to ON Semiconductor’s Board of Directors

Thursday March 22nd 2012 03:00:00 AM

PHOENIX, Ariz. – March. 22, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, today announced that Teresa M. Ressel and Bernard L. Han have joined its Board of Directors. The Board also appointed Ms. Ressel to its Audit Committee. In addition, Atsushi Abe, a current member of ON Semiconductor’s Board of Directors, was appointed to both the Audit Committee and Compensation Committee.

“Teresa Ressel and Bernard Han are outstanding additions to our Board of Directors,” said Dan McCranie, chairman of ON Semiconductor’s Board of Directors. “Teresa brings significant financial, corporate governance and regulatory experience from her management and leadership roles in both the private and public sectors. Bernard’s current experience as the Chief Operating Officer of an organization with more than 25,000 people, as well as his impressive history of demonstrated leadership and financial expertise will be a strong addition to our Board. These two new members of our Board will be valuable as we continue to align the company toward our vision of becoming the premier supplier of high performance energy efficient silicon solutions worldwide.”

Teresa M. Ressel served in an executive role for UBS Investment Bank from 2004 until earlier this year. She joined the investment bank as Chief Operating Officer (COO) of the Americas group, and was in 2007 also named Chief Executive Officer (CEO) of UBS Securities LLC which is responsible for UBS’ broker dealer operations. In these roles, Ms. Ressel managed a broad array of supervisory control, regulatory, compliance, and logistics functions covering the United States and Canada, as well as banking activities intersecting the Americas. From 2001 until 2004, Ms. Ressel served at the United States Department of the Treasury. She was confirmed by the U.S. Senate as the Ninth Assistant Secretary for Management of the U.S. Department of the Treasury and was designated by Presidential directive as the Chief Financial Officer of the department, where she served in both capacities. Between 1994 and 2000, Ms. Ressel was a Vice President and then Senior Vice President at Kaiser Permanente (“KP”). In her various positions at KP, Ms. Ressel served as the Vice President, Corporate Audit and Corporate Environmental Health & Safety Programs; the Vice President and Chief Compliance Officer; and the Senior Vice President and Chief Operating Officer, e-Commerce. From 1990 to 1994, Ms. Ressel was employed with Hewlett Packard as a Corporate Program Manager, first within the Corporate Manufacturing Group, Palo Alto, California, and subsequently Hewlett Packard Asia Pacific Ltd. Ms. Ressel has been a member of the Board of Trustees of the University of Connecticut Medical Center since 2009. She holds an MBA from Rensselaer Polytechnic Institute as well as a BS and MS in Engineering from the University of Delaware.

Bernard L. Han has served as the Chief Operating Officer of DISH Network Corporation since April 2009 where he is responsible for all operations and information technology functions. Mr. Han served as DISH Network’s Executive Vice President and Chief Financial Officer (CFO) from September 2006 until April 2009, and as Chief Information Officer from 2006 to 2007. Mr. Han also served as EchoStar Corporation’s Executive Vice President and CFO from January 2008 to June 2010 pursuant to a management services agreement between DISH Network and EchoStar. From October 2002 to May 2005, he served as Executive Vice President and Chief Financial Officer of Northwest Airlines, Inc. Mr. Han was the Executive Vice President and Chief Financial Officer of America West Airlines in 2002 before transitioning to Northwest Airlines during that same year. While at America West, he also worked in other senior level sales and marketing and financial planning positions from 1996 through 2001. Prior to joining America West, Mr. Han worked in various director and financial manager positions at Northwest Airlines between 1991 and 1995. Mr. Han holds an MBA, a Master of Electrical Engineering and a BS from Cornell University.

ON Semiconductor Introduces High Efficiency Wireless Charging ICs

Tuesday March 20th 2012 03:00:00 AM

PHOENIX, Ariz. – March 20, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN) a premier supplier of high performance silicon solutions for energy efficient electronics, has released the NMLU1210, an innovative power MOSFET integrated circuit (IC) for wireless charging applications in portable products such as cell phones, media tablets, portable media players, digital still cameras and GPS units.

The NMLU1210 is a 20 volt (V) N-channel full bridge semi-synchronous rectifier, that incorporates a dual Schottky barrier diode supporting up to 3.2 ampere (A) operation plus two MOSFETs with a 17 milli ohm (mΩ) (typical) Rds(ON) to minimize conduction losses and substantially increase efficiency of the charging system.

Wireless inductive charging is becoming increasingly popular, freeing consumers from the inconvenience of the traditional wired approach. It works on the principle of an electromagnetic field being created for the rapid transfer of energy between the transmitter (in the charging station) and the receiver (in the portable device). The NMLU1210 is used by the receiver side to convert AC voltage generated by the transmitter to DC voltage used for battery charging. Offered in an ultra-low inductance thermally efficient package, it is optimized specifically for power management tasks in portable electronic products. This compact IC is highly suited to use in space-constrained environments. It has an operational junction temperature of −55 ⁰C to 125 ⁰C.

“The NMLU1210 full bridge rectifier enables more efficient and faster wireless charging of portable electronics devices,” said Paul Leonard, vice president of ON Semiconductor’s Power MOSFET products division. “This innovative device will enable OEMs to offer their customers more flexibility in battery recharging which will give their products improved power features in an increasingly competitive consumer space.”

"ON Semiconductor is an important member of the Wireless Power Consortium,” said Menno Treffers, chairman of the Wireless Power Consortium. “The addition of NMLU1210 to ON Semiconductor's extensive product portfolio gives the industry more choice and makes it possible to apply the Qi wireless power standard in far more applications and products."

Packaging and Pricing

The NMLU1210 offered in a 4.0 mm x 4.0 mm x 0.5 mm µCool, RoHS-compliant package. The device is priced at $0.70 per unit in 10,000 unit quantities.

ON Semiconductor Announces Redemption of its Zero Coupon Convertible Senior Subordinated Notes Due 2024

Monday March 12th 2012 03:00:00 AM

PHOENIX, Ariz. – march 12, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN) today announced that it is exercising its option to redeem all remaining outstanding Zero Coupon Convertible Senior Subordinated Notes due 2024, Series B (CUSIP No. 682189AE5) (the "Notes") amounting to an aggregate principal amount of $96,235,000. The redemption date will be on April 16, 2012. ON Semiconductor expects to fund the payment of this redemption using available liquidity.

The redemption price is equal to $1,000 per $1,000 principal amount of the Notes. Payment of the redemption price will be made upon surrender of the Notes at the addresses provided by the trustee of the Notes in the notice of redemption. A copy of the notice of redemption may be obtained from Wells Fargo Bank, National Association, as trustee and conversion agent by calling 1-800-344-5128.

The holders of the Notes have the right to convert their Notes into shares of common stock of ON Semiconductor at a conversion rate of 101.8849 shares per $1,000 principal amount of Notes until the close of business on April 13, 2012. ON Semiconductor will satisfy its conversion obligation with respect to each $1,000 principal amount of Notes tendered for conversion by delivering cash equal to the sum of the daily conversion values, including cash for any net share amount. The observation period will include the 20 consecutive trading days beginning on and including the third trading day after the delivery of a conversion notice to the conversion agent. Holders who wish to convert their Notes must comply with the procedures in the Notes.

“We are pleased to announce the exercise of ON Semiconductor’s option to redeem approximately $96.2 million of the Zero Coupon Convertible Senior Subordinated Notes,” said Donald Colvin, ON Semiconductor executive vice president and CFO. “ON Semiconductor began 2012 with its highest cash, cash equivalents and short-term investments balance in its history at approximately $901.5 million. With this redemption, ON Semiconductor will reduce its leverage and will eliminate future potential share dilution associated with the Notes. We remain committed to improving the capital structure of the company and continue to examine opportunities to improve shareholder value.”

# # #

This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical facts, included or incorporated in this document could be deemed forward-looking statements, particularly statements about the future financial performance of ON Semiconductor. These forward-looking statements are often characterized by the use of words such as “believes,” “estimates,” “expects,” “projects,” “may,” “will,” “intends,” “plans,” or “anticipates,” or by discussions of strategy, plans or intentions. All forward-looking statements in this document are made based on information available to us as of the date of this release, our current expectations, forecasts and assumptions, and involve risks, uncertainties and other factors that could cause results or events to differ materially from those expressed in the forward-looking statements. Among these factors are our revenues and operating performance, poor economic conditions and markets (including current credit and financial conditions), effects of exchange rate fluctuations, the cyclical nature of the semiconductor industry, changes in demand for our products, changes in inventories at our customers and distributors, technological and product development risks, enforcement and protection of our intellectual property rights and related risks, availability of raw materials, electricity, gas, water and other supply chain uncertainties, our ability to effectively shift production to other facilities in order to maintain supply continuity for our customers, variable demand and the aggressive pricing environment for semiconductor products, our ability to successfully manufacture in increasing volumes on a cost-effective basis and with acceptable quality for our current products, competitors’ actions including the adverse impact of competitive product announcements, pricing and gross profit pressures, loss of key customers, order cancellations or reduced bookings, changes in manufacturing yields, control of costs and expenses and realization of cost savings from restructurings and synergies, significant litigation, risks associated with decisions to expend cash reserves for various uses such as debt prepayment or acquisitions rather than to retain such cash for future needs, risks associated with acquisitions and dispositions (including from integrating and consolidating, and timely filing financial information with the Securities and Exchange Commission for, recently acquired businesses, such as SANYO Semiconductor, and difficulties encountered in accurately predicting the future financial performance of recently acquired businesses, such as SANYO Semiconductor), risks associated with our substantial leverage and restrictive covenants in our debt agreements from time to time, risks associated with our worldwide operations including foreign employment and labor matters associated with unions and collective bargaining arrangements as well as man-made and/or natural disasters such as the flooding in Thailand or the Japan earthquake and tsunami affecting our operations and finances/financials, the threat or occurrence of international armed conflict and terrorist activities both in the United States and internationally, risks and costs associated with increased and new regulation of corporate governance and disclosure standards (including pursuant to Section 404 of the Sarbanes-Oxley Act of 2002), risks related to new legal requirements and risks involving environmental or other governmental regulation. Information concerning additional factors that could cause results to differ materially from those projected in the forward-looking statements is contained in ON Semiconductor’s Annual Report on Form 10-K for the period ended December 31, 2011, Quarterly Reports on Form 10-Q, Current Reports on Form 8-K and other of our filings with the Securities and Exchange Commission. If any of these trends, risks or uncertainties actually occurs or continues, our business, financial condition or operating results could be materially adversely affected, the trading prices of our securities could decline, and investors could lose all or part of their investment. Readers are cautioned not to place undue reliance on forward-looking statements. These forward-looking statements should not be relied upon as representing our views as of any subsequent date and we do not undertake any obligation to update forward-looking statements to reflect events or circumstances after the date they were made.

ON Semiconductor to Showcase Extensive Offering of LED Lighting Solutions at “LED Next Stage 2012” in Tokyo

Monday March 5th 2012 02:00:00 AM

LED Next Stage 2012 – TOKYO, Japan – March 5, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, will showcase its broad portfolio of LED lighting solutions and launch a Japanese language version of its interactive GreenPoint® LED design simulation tool at LED Next Stage 2012 to be held at Tokyo Big Sight from March 6-9.

The LED Lighting solutions to be demonstrated include:
• General Lighting: dimming/non-dimming bulbs, wall pack for architectural lighting, T5 tube, desk lamp and solar-powered street sign
• Automotive Lighting: LED front light and interior lighting
• LED Backlight for LCD-TV
• Mobile Lighting: LED drivers for camera flash and color LCD screen

Among the ON Semiconductor products to be demonstrated, the following LED drivers for various applications are reflective of the company’s continued development of innovative technologies to enable energy-efficient lighting solutions:

Application for Architectural Lighting, Area and Street Lighting
The NCL30051, power factor correction (PFC) and Resonant Half Bridge combo controller, LED driver combined with the NCL30160, a constant current step-down (buck) LED driver, provide an ideal solution for high-brightness LED applications where very high efficiency is important, such as area and street lights.

Replacement of Fluorescent Tube with LED Lighting
The NSIC2050 is a constant current regulator for LED applications. By using the NSIC2050, a two-terminal device with a 120 V maximum voltage as an LED driver, LED lighting with lower component cost can be achieved.

Application for Dimmable LED Bulbs (E26 Bulb)
The LV5026 is an LED driver for various dimming methods, such as TRIAC, analog and PWM. By connecting to an external FET, this device can accommodate a wide range of rated outputs.

GreenPoint® Design Simulation Tool for Japanese-Language Customers
ON Semiconductoris to launch its Japanese language version of the interactive GreenPoint® design simulation tool for high-efficiency LED based lighting applications on March 6 at the trade show. The GreenPoint® design tool is an interactive design and verification environment that assists in accelerating the board design. Utilizing a user’s design requirements such as LED configuration, voltage, current or switching frequency, the GreenPoint® design tool automatically optimizes the circuit configuration and selects appropriate values for inductors and capacitors. The resulting design is presented to the user as an interactive online schematic running in any web browser. Engineers can instantly test the solution and run a number of What-If analyses, essentially providing a virtual online test bed.

Comprehensive LED Lighting Solutions
ON Semiconductor’s broad portfolio of energy efficient power and signal management devices complement its LED driver ICs to enable customers to design complete lighting solutions. This includes thermal management products, ambient light sensors and occupancy sensors, powerline communications ICs, and discrete power and protection devices.

LED Next Stage 2012 – ON Semiconductor Booth LD1012
ON Semiconductor will be exhibiting its full portfolio of LED lighting solutions including the GreenPoint® application support solution at LED Next Stage 2012 from March 6-9 at Booth LD1012 in West Exhibition Hall 1F of Tokyo Big Sight, Japan.

NOTE: ON Semiconductor acquired SANYO Semiconductor in 2011 and has established the business as a division within the company. SANYO Semiconductor LED lighting solutions will be among those demonstrated at the show.

ON Semiconductor Wins “Power Management Product of the Year” Award from EE Times China for Automotive Device

Monday February 27th 2012 02:00:00 AM

SHENZHEN, China. – Feb. 27, 2012– ON Semiconductor Corporation (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has won “Product of the Year” for its NCV8871 automotive grade non-synchronous boost controller in the power management category of EE Times China’s Annual Creativity in Electronics (ACE) Awards 2012.

The annual ACE Awards recognize companies and products that facilitate innovative electronic design in mainland China and showcase the best of the best in today's electronics industry.

"We are proud to see our product recognized by an industry-leading award, which is also a strong endorsement of our development effort and evidence of our continued leadership in power management for automotive applications," said Hemen Cheng, senior director of Global Sales and Marketing for Power and Portable Products at ON Semiconductor. "We remain committed to developing innovative and high-performance technologies and products to offer energy efficient automotive solutions that simplify design process and shorten design time."

The NCV8871 is a wide input voltage device, with a range of 3.2 volts (V) to 44 V, which can be used to drive an external N−channel MOSFET. The device incorporates an internal regulator that supplies charge to the gate driver. This boost controller has a 3.0 microampere (µA) quiescent current when in sleep mode, allowing power consumption to be minimized. It features a synchronizable switching frequency, with two available versions that can be set at 170 kHz typical, or 1 MHz typical. Peak current mode control with internal slope compensation ensures device stability over the wide automotive battery range. This also ensures the device is protected during a current fault condition by turning off the power switch for the remainder of the cycle if the current limit is exceeded. Further protection is provided by a thermal shutdown mechanism (with a 170 ⁰C threshold) and a 3.1 V undervoltage lockout.

The NCV8871 is highly programmable, with various other frequency options available upon request. Additional options include different slope compensation values, current limit set points, and different gate drive voltages for interfacing with various MOSFETs. The device also supports multiple topology configurations, including boost, flyback, SEPIC, and multi-phase. Output power ranges from a few watts (W) up to 200 W in a boost topology.

The NCV8871 has an operating junction temperature of −40 ⁰C to 150 ⁰C. The device is offered in a Pb-free, RoHS compliant SOIC-8 package.

ON Semiconductor Executives to Present at Investor Conferences

Monday February 27th 2012 02:00:00 AM

PHOENIX, Ariz. – Feb. 27, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has announced that executives from the Company will present at the following investor conferences:

• Morgan Stanley Technology, Media & Telecom Conference – Tuesday, February 28, at 2:45 p.m. (PST) at the Palace Hotel in San Francisco, CA.

• Wedbush Securities’ 2012 Technology, Media & Telecommunications Management Access Conference – Wednesday, March 7, at 3:40 p.m. (EST) at the Le Parker Meridien Hotel in New York City, NY.

ON Semiconductor will provide a webcast of the conference presentations on the Investors section of its website at http://www.onsemi.com.

ON Semiconductor Introduces New Series of Adjustable Output Low Dropout Voltage Regulators for Automotive Applications

Wednesday February 22nd 2012 02:00:00 AM

PHOENIX, Ariz. – Feb. 22, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has announced two new low dropout (LDO) voltage regulator ICs. Building on the company’s market-leading power management portfolio for automotive applications, the new devices are ideal for use in audio and infotainment systems, instrument cluster, navigation and satellite radio.

ON Semiconductor Reports Fourth Quarter and 2011 Annual Results

Wednesday February 8th 2012 02:00:00 AM

For the fourth quarter of 2011, highlights include:
• Total revenues of approximately $767.9 million
• GAAP gross margin of 31.1 percent
• Non-GAAP gross margin of 32.9 percent
• GAAP net loss per fully diluted share of $0.02
• Non-GAAP net income per fully diluted share of $0.13
• Record cash, cash equivalents and short-term investments of $901.5 million
• Completed a $325 million five-year senior revolving credit facility
• Extended debt maturity of $198.6 million of 2.625% convertible senior subordinated notes from December 2013 to December 2016 via a notes exchange

For 2011, highlights include:
• Record total revenues of approximately $3.442 billion, up approximately 49 percent compared to 2010
• Record adjusted EBITDA of $626.7 million
• Completed the acquisitions of SANYO Semiconductor in January and the CMOS Image Sensor Business Unit from Cypress Semiconductor in February

PHOENIX, Ariz. – Feb. 8, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN) today announced that total revenues in the fourth quarter of 2011 were $767.9 million, a decrease of approximately 14 percent from the third quarter of 2011. During the fourth quarter of 2011, as previously indicated, the company was negatively impacted from the flood in Thailand. During the fourth quarter of 2011, the company reported a GAAP net loss of $8.8 million, or $0.02 per fully diluted share. The fourth quarter 2011 GAAP net loss was impacted by $67.2 million of special items which include restructuring, asset impairment and other charges, which were primarily related to the Thailand flood and charges associated with the convertible notes exchange. The complete special item details can be found in the attached schedules.

Fourth quarter 2011 non-GAAP net income was $58.4 million, or $0.13 per share on a fully diluted basis. Third quarter 2011 non-GAAP net income was $110.5 million, or $0.24 per share on a fully diluted basis. A reconciliation of these non-GAAP financial measures (and other non-GAAP measures used elsewhere in this release, such as non-GAAP gross margin and adjusted EBITDA) to the company’s most directly comparable measures prepared in accordance with U.S. GAAP are set forth in the attached schedules and on our website at http://www.onsemi.com/.

On a mix-adjusted basis, average selling prices for ON Semiconductor in the fourth quarter of 2011 were down approximately two to three percent when compared to the third quarter of 2011. Total company GAAP gross margin in the fourth quarter was 31.1 percent. Total company GAAP gross margin in the fourth quarter included a net charge of approximately $13.3 million, or approximately 180 basis points, from special items including the Thailand related inventory write down. Total company non-GAAP gross margin in the fourth quarter was 32.9 percent.

Adjusted EBITDA for the fourth quarter of 2011 was $122.0 million. Adjusted EBITDA for the third quarter of 2011 was $169.9 million.

Total revenues for 2011 were a record $3.442 billion, an increase of approximately 49 percent from $2.313 billion in 2010. During 2011, the company reported GAAP net income of $11.6 million, or $0.03 per fully diluted share. The 2011 GAAP net income included net charges of $383.5 million from special items. During 2010, the company reported GAAP net income of $290.5 million, or $0.65 per fully diluted share. The 2010 GAAP net income included net charges of $105.3 million from special items. The special item details can be found in the attached schedules.

The non-GAAP net income for 2011 was $395.1 million, or $0.86 per share on a fully diluted basis. The non-GAAP net income for 2010 was $395.8 million, or $0.89 per share on a fully diluted basis.

The company’s GAAP gross margin in 2011 was 29.3 percent. GAAP gross margin in 2011 included a net charge of approximately $190.8 million, or approximately 550 basis points, from special items. Non-GAAP gross margin in 2011 was 34.8 percent. The company’s GAAP gross margin in 2010 was 41.3 percent. GAAP gross margin in 2010 included a net charge of approximately $10.4 million, or approximately 50 basis points, from special items. Non-GAAP gross margin in 2010 was 41.8 percent. The special item details can be found in the attached schedules.

“2011 was a transformational year for the company,” said Keith Jackson, ON Semiconductor president and CEO. “During the year we completed the acquisitions of SANYO Semiconductor and the CMOS Image Sensor Business Unit. We achieved record annual revenues and adjusted EBITDA in 2011 and ended the year with our highest cash, cash equivalents and short term-investments in our history at over $900 million. After a challenging second half of 2011 for the industry and ON Semiconductor, we believe that the first quarter of 2012 represents the bottom of the current semiconductor cycle.”

FIRST QUARTER 2012 OUTLOOK
“During the fourth quarter, the company faced significant challenges related to the flood in Thailand and the resulting damage to our SANYO Semiconductor manufacturing facilities located in that country,” Jackson said. “Our SANYO Semiconductor segment revenue in the first quarter of 2012 will continue to be negatively impacted by lower production capacity as a result of the Thailand flood. We are, however, expecting SANYO Semiconductor revenues to be approximately flat compared to the fourth quarter of 2011 as orders that were fulfilled out of finished goods inventory in the fourth quarter of 2011 will begin to be fulfilled from production capacity at other locations within our global internal and external manufacturing network in the first quarter of 2012. We also believe that the historical ON Semiconductor business will be seasonally down in the first quarter of 2012.”

“Based upon product booking trends, backlog levels and estimated turns levels, we anticipate that total ON Semiconductor revenues will be approximately $720 to $760 million in the first quarter of 2012,” Jackson said. “Backlog levels for the first quarter of 2012 represent approximately 80 to 85 percent of our anticipated first quarter 2012 revenues. We expect that average selling prices for the first quarter of 2012 will be down approximately two to three percent when compared to the fourth quarter of 2011. The non-GAAP outlook for the first quarter of 2012 includes stock-based compensation expense of approximately $8 to $10 million.”

The following table outlines ON Semiconductor’s projected first quarter of 2012 GAAP and non-GAAP outlook.

* Convertible Notes, Non-cash Interest Expense is pursuant to FASB’s Accounting Standards Codification (“ASC”) Topic 470: Debt.
** Fully diluted share count can vary for, among other things, the actual exercise of options or restricted stock units, the incremental dilutive shares from all of the company’s convertible senior subordinated notes, and the repurchase or the issuance of stock or convertible notes or the sale of treasury shares. Please refer to the table on our website for potential changes to the Fully Diluted Share Count. This table can be found on our website at http://www.onsemi.com under Investors - Investor Relations, Quarterly Results.
*** Special Items can include: amortization of intangible assets, amortization of acquisition-related intangibles, expensing of inventory fair market value step-up, inventory write downs, purchased in-process research and development expenses, inventory valuation adjustments, restructuring, asset impairments and other, net, goodwill impairment charges, gains and losses on debt prepayment, income tax adjustments to approximate cash taxes, non-cash interest expense, their related tax effects and certain other special items as appropriate.
**** Regulation G and other provisions of the securities laws regulate the use of financial measures that are not prepared in accordance with GAAP. We believe these non-GAAP measures provide important supplemental information to investors. We use these measures, together with GAAP measures, for internal managerial purposes and as a means to evaluate period-to-period comparisons. However, we do not, and you should not, rely on non-GAAP financial measures alone as measures of our performance. We believe that non-GAAP financial measures reflect an additional way of viewing aspects of our operations that – when taken together with GAAP results and the reconciliations to corresponding GAAP financial measures that we also provide in our releases – provide a more complete understanding of factors and trends affecting our business. Because non-GAAP financial measures are not standardized, it may not be possible to compare these financial measures with other companies’ non-GAAP financial measures, even if they have similar names.

FINANCIALS

TELECONFERENCE
ON Semiconductor will host a conference call for the financial community at 5:00 p.m. Eastern Time (ET) on February 8, 2012, to discuss this announcement and ON Semiconductor’s fourth quarter and 2011 annual results. The company will also provide a real-time audio webcast of the teleconference on the Investor Relations page of its website at http://www.onsemi.com. The webcast replay will be available at this site approximately one hour following the live broadcast and will continue to be available for approximately 30 days following the conference call. Investors and interested parties can also access the conference call through a telephone call by dialing (888) 546-9664 (U.S./Canada) or (973) 935-8144 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 48965565. Approximately one hour following the live broadcast, the company will provide a dial-in replay that will continue to be available through February 15, 2012. To listen to the teleconference replay, call (855) 859-2056 (U.S./Canada) or (404) 537-3406 (International). You will be required to provide the Conference ID Number – which is 48965565.

This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical facts, included or incorporated in this document could be deemed forward-looking statements, particularly statements about the future financial performance of ON Semiconductor. These forward-looking statements are often characterized by the use of words such as “believes,” “estimates,” “expects,” “projects,” “may,” “will,” “intends,” “plans,” or “anticipates,” or by discussions of strategy, plans or intentions. All forward-looking statements in this document are made based on information available to us as of the date of this release, our current expectations, forecasts and assumptions, and involve risks, uncertainties and other factors that could cause results or events to differ materially from those expressed in the forward-looking statements. Among these factors are the uncertainty surrounding natural disasters, including the ongoing impact of the flood in Thailand, including availability of historical books and financial and corporate records and data, labor and supply costs, our ability to effectively shift production to other facilities in order to maintain supply continuity for our customers, any impact on our controls and procedures, our ability to collect on insurance claims and the timing thereof, the fact that the timing of events could differ materially from those anticipated, uncertainties as to restructuring, impairment and other costs and charges including the potential for unanticipated charges not currently contemplated and our revenues and operating performance. Other factors include poor economic conditions and markets (including current credit and financial conditions), effects of exchange rate fluctuations, the cyclical nature of the semiconductor industry, changes in demand for our products, changes in inventories at our customers and distributors, technological and product development risks, enforcement and protection of our intellectual property rights and related risks, availability of raw materials, electricity, gas, water and other supply chain uncertainties, our ability to effectively shift production to other facilities in order to maintain supply continuity for our customers, variable demand and the aggressive pricing environment for semiconductor products, our ability to successfully manufacture in increasing volumes on a cost-effective basis and with acceptable quality for our current products, competitor actions including the adverse impact of competitor product announcements, pricing and gross profit pressures, loss of key customers, order cancellations or reduced bookings, changes in manufacturing yields, control of costs and expenses and realization of cost savings from restructurings and synergies, significant litigation, risks associated with decisions to expend cash reserves for various uses such as debt prepayment or acquisitions rather than to retain such cash for future needs, risks associated with acquisitions and dispositions (including from integrating and consolidating, and timely filing financial information with the Securities and Exchange Commission for, acquired businesses, such as SANYO Semiconductor, and difficulties encountered in accurately predicting the future financial performance of acquired businesses, such as SANYO Semiconductor), risks associated with our substantial leverage and restrictive covenants in our debt agreements from time to time, risks associated with our worldwide operations including foreign employment and labor matters associated with unions and collective bargaining arrangements as well as man-made and/or natural disasters such as the flooding in Thailand or the Japan earthquake and tsunami affecting our operations and finances/financials, the threat or occurrence of international armed conflict and terrorist activities both in the United States and internationally, risks and costs associated with increased and new regulation of corporate governance and disclosure standards (including pursuant to Section 404 of the Sarbanes-Oxley Act of 2002), risks related to new legal requirements and risks involving environmental or other governmental regulation. Information concerning additional factors that could cause results to differ materially from those projected in the forward-looking statements is contained in ON Semiconductor’s Annual Report on Form 10-K, Quarterly Reports on Form 10-Q, Current Reports on Form 8-K and other of our filings with the Securities and Exchange Commission. If any of these trends, risks or uncertainties actually occurs or continues, our business, financial condition or operating results could be materially adversely affected, the trading prices of our securities could decline, and investors could lose all or part of their investment. Readers are cautioned not to place undue reliance on forward-looking statements. These forward-looking statements should not be relied upon as representing our views as of any subsequent date and we do not undertake any obligation to update forward-looking statements to reflect events or circumstances after the date they were made.

ON Semiconductor Showcases Breakthrough Power Products for Reducing Energy Consumption in Standby Mode at APEC 2012

Monday February 6th 2012 02:00:00 AM

Applied Power Electronics Conference (APEC) – ORLANDO, Florida – Booth 200 - Feb. 6, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, continues to develop innovative technology and products that allows it to offer a broad portfolio of power semiconductor solutions to the market.

ON Semiconductor Names Its 2011 Distribution Partner Award Winners

Thursday February 2nd 2012 02:00:00 AM

PHOENIX, Ariz. – Feb. 2, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN) a premier supplier of high performance silicon solutions for efficient electronics, has announced its top 2011 distribution partners. These awards honor the distributor in each region that led overall channel sales, grew market share, captured increased sales of products from acquisitions made by ON Semiconductor, and scored high on overall process excellence.

The 2011 awards are as follows:

• Arrow Electronics: Leading Distribution Partner for the Americas
• Arrow Electronics: Leading Distribution Partner for Europe
• Yosun: Leading Distribution Partner for China
• World Peace International: Leading Distribution Partner for Taiwan
• Uniquest: Leading Distribution Partner for Korea
• Arrow Electronics: Leading Distribution Partner for Southeast Asia
• Yosun: Leading Distribution Partner for India

• Mouser Electronics: Leading Global Distribution Partner for New Product Introduction

“Distribution sales accounted for approximately 36 percent of ON Semiconductor’s 2011 annual revenues and are expected to continue to grow,” said Jeff Thomson, vice president of Global Channel Sales for ON Semiconductor. “The ongoing market penetration and overall product revenue growth of the company continue to be highly dependent on the collaborative working relationships and unique channel sales programs we have fostered with our worldwide distribution partners. Each of the 2011 award winners successfully grew product sales, generated significant new business, and effectively supported both our customers’ needs and ON Semiconductor’s initiatives for operational excellence. ON Semiconductor is pleased to recognize these outstanding channel partners for their valuable contributions throughout 2011.”

ON Semiconductor to Announce Fourth-Quarter and 2011 Financial Results

Tuesday January 31st 2012 02:00:00 AM

PHOENIX, Ariz. – Jan. 31, 2012 – ON Semiconductor Corporation (Nasdaq: ONNN) a premier supplier of high performance silicon solutions for energy efficient electronics, plans to announce its financial results for the fourth quarter ending December 31, 2011, after the market closes on Wednesday, February 8, 2012.

The company will host a conference call at 5:00 p.m. Eastern Time (ET) on February 8, following the release of its financial results. Investors and interested parties can access the conference call in the following manner:

• Webcast: A live webcast of the conference call will be available via the “Investors” section of the company’s website at http://www.onsemi.com. The re-broadcast of the call will be available at this site approximately one hour following the live broadcast and will continue for 30 days.

• Teleconference: A telephone conference of the earnings report can be accessed by dialing 888-546-9664 (U.S./Canada) or 973-935-8144 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 48965565.

• Teleconference Replay: Approximately one hour following the live broadcast, the company will provide a dial-in replay that will continue to be available through February 15, 2012. To listen to the teleconference replay, call 855-859-2056 (U.S./Canada) or 404-537-3406 (International). You will be required to provide the Conference ID Number – which is 48965565.

ON Semiconductor Receives Trusted Foundry and Broker Accreditations

Tuesday January 17th 2012 02:00:00 AM

PHOENIX, Ariz. – Jan. 17, 2012 – ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has been granted Category 1A Trusted Foundry accreditation for its Pocatello, Idaho, ‘Fab 10’, and Gresham, Oregon, facilities. The Trusted Foundry Program is a Department of Defense (DOD) project to accredit trusted, secure sources for the development and manufacture of Application Specific Integrated Circuits (ASICs) for a wide range of critical DOD applications including GPS, thermal imaging and encrypted media. The program seeks to negate the potential risk of system counterfeiting, tampering or sabotage.