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Intel (INTC)
The Intel CRUSH Report is a Global 500 deep dive sales intelligence company profile and will help increase your sales leads and add more accounts in your sales pipeline while eliminating costly research time.
The Intel CRUSH Report contains insights to IT architectures, business and technology initiatives, corporate strategies, projects and budgets, org charts and key decision-maker contact info. The Intel CRUSH Report allows IT sales and marketing professionals to:
Click here to download free sample CRUSH Reports Intel Press RoomRecent Intel press releases.
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| WHAT: | Intel Corporation will host a keynote and series of events at Computex Taipei 2012 to highlight its ongoing innovation and collaboration with the computing industry to deliver engaging, consistent and secure user experiences across devices to the cloud. These devices include Ultrabook systems, PCs, smartphones and tablets. Intel’s presence at Computex 2012 will kick off with the opening keynote address by Tom Kilroy, senior vice president and general manager of Intel’s Sales and Marketing Group. His address will be June 5 at the Taipei International Convention Center (TICC), 3F Plenary Hall. Intel will also organize satellite events on personal computing and the cloud in addition to exhibiting a wide range of devices and the latest technologies at the Nangang Exhibition Hall of the Taipei World Trade Center on June 5-9. |
| DATES: | June 5-8 (9:30 a.m.-6 p.m.) June 9 (9:30 a.m.-4 p.m.) |
| WHERE: | Intel Exhibition Showcase at Computex Booth M410 Taipei World Trade Center, Nangang Exhibition Hall (No. 1, Jing Mao 2nd Road, Nangang District, Taipei) |
| MEDIA ACTIVITIES: | Intel Thunderbolt Technology Briefing Event Time: June 4, 12-1 p.m. (Reception: 11:30 a.m.-noon) Event Venue: B1 Gallery Room, Bellavita (28 Songren Road, Taipei) Speakers: Thomas Swinford, vice president, Intel Architecture Group, general manager, Communications and Networking Group Jason Ziller, director of Thunderbolt marketing and planning, Intel Architecture Group Intel Booth Guided Tour for Media Event Time: June 5, 11 a.m.-noon Event Venue: Booth M410, Taipei World Trade Center, Nangang Exhibition Hall, 4F (3/F, No.1, Jingmao 2nd Road, Taipei) Please register at http://220.135.105.245/press2012/en.html or on site at the 1F reception counter of the Nangkang Exhibition Hall to get the media badge. Computex Opening Keynote Event Time: June 5, 2-3 p.m. (Reception: 1:20- p.m.) Event Venue: Taipei International Convention Center, 3F Plenary Hall (No. 1, Xin-yi Road, Sec. 5, Hsin-yi District, Taipei) Speaker: Tom Kilroy, senior vice president and general manager, Sales and Marketing Group Please register at http://www.e21forum.com.tw/Register.aspx?nav=9&lang=1 or on site at the 1F reception counter of the Taipei International Convention Center to get the media badge. Post-Keynote Media Q&A Session with Kilroy Event Time: June 5, 3:15-3:40 p.m. Event Venue: Grand Hyatt Hotel, 2F, Drawing Room (No. 2, Song Shou Road, Hsin-yi District, Taipei) Intel Speaker: Tom Kilroy, senior vice president and general manager, Sales and Marketing Group Personal Computing Satellite Event and Media Q&A Event Time: June 5, 3:45-4:35 p.m. (Reception: 3:15-3:45 p.m.) Event Venue: Grand Hyatt Hotel, 3F, Ballroom (No. 2, Song Shou Road, Hsin-yi District, Taipei). A media Q&A session with the speakers will immediately follow from 4:35-5 p.m. Intel Speakers: Kirk Skaugen, vice president and general manager, PC Client Group Gregory Bryant, vice president, Sales and Marketing Group, and general manager, Asia-Pacific Region Cloud Computing Satellite Event and Media Q&A Event Time: June 6, 12:50-1:40 p.m. (Reception: 12:30-12:50 p.m.) Event Venue: Grand Hyatt Hotel, 3F, Ballroom (No. 2, Song Shou Road, Hsin-yi District, Taipei). A media Q&A session with the speakers will immediately follow from 1:40-2 p.m. Intel Speakers: Boyd Davis, vice president, Intel Architecture Group, and general manager, Datacenter Infrastructure Group Gregory Bryant, vice president, Sales and Marketing Group, and general manager, Asia-Pacific Region |
| INTEL MEDIA SUPPORT AT COMPUTEX: | Please visit the reception counter of the Intel Exhibition Showcase at 4/F, TWTC Nangang Exhibition Hall, to access the latest Intel news releases, fact sheets and other media materials. |
| MEDIA CONTACTS: | Intel Corporation: Kari Aakre, Intel PR manager, +1-503-696-5068, kari.e.aakre@intel.com Shardae Chiu, Intel PR manager, +8862-2544-7752, shardae.chiu@intel.com Pallas PR Agency: Jennifer Chen, Pallas PR, +8862-2719-5077 Ext. 223, jennifer@pallaspr.com.tw Elsa Chang, Pallas PR, +8862-2719-5077 Ext. 220, elsa.chang@pallasrp.com.tw |
| MAPS: | Bellavita & Taipei International Convention Center & Grand Hyatt Hotel  B1, Gallery Room, Bellavita  3F, Plenary Hall, Taipei International Convention Center (TICC)  2F, Drawing Room, Grand Hyatt Hotel  3F, Ballroom, Grand Hyatt Hotel  |
Chip Shot: Celebrate National Chocolate Chip Day!Thursday May 17th 2012 10:50:08 AM
On this prestigious and sugary occasion, we give you the top apps to commemorate National Chocolate Chip Day! Before tackling teaspoons of this and tablespoons of that, make sure you have your culinary questions answered with Wolfram Alpha. Then use cupNoz to quickly convert measurements for and while cooking. In between kneading dough and sprinkling chips, listen to mySongBook Player, an app that gives you access to full scores and songbooks. Once the baking is complete, share pictures of your chocolate chip success with the Snap! app.
Intel Sets 2020 Environmental GoalsThursday May 17th 2012 10:39:27 AM
Publishes 2011 Corporate Responsibility Report
NEWS HIGHLIGHTS
- In its 2011 Corporate Responsibility Report, Intel sets new 2020 environmental goals to extend its path of innovation and environmental responsibility.
- Intel incorporated an integrated approach into this report, providing information on the connection between corporate responsibility performance and the creation of business value.
- Intel also reports on increased supplier assessments, renewable power and energy efficiency successes, employee engagement and green building design, among other topics.
SANTA CLARA, Calif., May 17, 2012 – Building on nearly 2 decades of reporting on its environmental commitments and performance, Intel Corporation today released its 2011 Corporate Responsibility Report, which includes new 2020 environmental goals to drive continuous improvement in the company's manufacturing operations and the energy efficiency of its products. Intel's new 2020 environmental goals include:
- Reduce direct greenhouse gas emissions by 10 percent on a per chip basis by 2020 from 2010 levels1.
- Design all new buildings to a minimum Leadership in Energy and Environmental Design (LEED) Silver Certification between 2010 and 2020.
- Increase the energy efficiency of notebook computers and data center products 25 times by 2020 from 2010 levels2.
- Achieve additional energy savings of 1.4 billion kWh from 2012 to 2015, and publish additional energy conservation targets for 2016–2020 in its 2012 report.
- Reduce water use on a per chip basis below 2010 levels by 2020.
- Achieve zero chemical waste to landfill by 2020.
"At Intel, corporate responsibility is a crucial component to the overall growth of our business," said Michael Jacobson, Intel's director of corporate responsibility. "From product to customer to employee to environment, corporate responsibility allows Intel to have a greater and more influential impact on industries, communities and the global economy."
Other highlights from the 2011 report include:
Supply Chain Responsibility
- Intel was again recognized in the Gartner Supply Chain Top 25 list for excellence in supply chain management, ranking 16th in 2011, up from 18th in 2010 and 25th in 2009.
- To address the issue of conflict minerals, through the end of 2011, Intel had identified 98 smelter sites and visited 48 of them in 16 countries to lay the groundwork for third-party audits. Intel's goal is to demonstrate that its microprocessors are validated as conflict-free for tantalum by the end of 2012, and to manufacture the world's first microprocessor fully validated as conflict-free across all four minerals (gold, tantalum, tin and tungsten) by the end of 2013.
Renewable Power
- For the past 4 years, Intel has been recognized as the largest voluntary purchaser of green power in the United States, under the U.S. Environmental Protection Agency's Green Power Partnership program.
- Since 2009, Intel has collaborated with third parties to complete 15 solar electric installations across nine Intel campuses in Arizona, California, New Mexico, Oregon, Israel and Vietnam — collectively generating more than 5 million kWh per year of clean energy.
- Since 2001, Intel has invested more than $58 million and completed over 1,563 energy conservation and energy efficiency projects, saving more than 825 million kWh of energy, or the approximate CO2 emissions from the electricity use of more than 70,933 average U.S. homes for 1 year. These investments also enabled Intel to reduce energy costs in 2011 by $10.9 million.
Employee Engagement
- Since 2008, Intel has linked a portion of its employees' variable compensation to environmental sustainability metrics.
- In 2011, as part of Intel's Environmental Excellence Awards, 62 employee teams from around the world were nominated for their work that helped Intel reduce its environmental impact. In fact, the estimated annual cost savings from the 2011 winning projects exceeded $70 million.
- In 2011, Intel provided $125,000 in funding for nine employee projects via its Sustainability in Action grant program — including the installation of a rainwater harvesting project at a school in Israel and the design of a zero-emissions heating and cooling control and supply system for a local community building in China.
- In 2011, 50 percent of Intel employees donated over 1.1million hours of service through the Intel Involved volunteer program — an average of 13 hours per employee — at 5,100 schools and nonprofit organizations in 45 countries.
Green Building Design and LEED Certification
- By the end of 2011, Intel had achieved LEED Silver Certification for a total of 18 buildings across five sites in Arizona, Costa Rica, China, Israel and Malaysia.
Education
- In 2011, Intel reached its goal of providing professional development through the Intel Teach
® program to over 10 million teachers in more than 70 countries, reaching over 300 million students. In addition, the program was introduced in Uganda, Zimbabwe, Gabon and Tanzania. - In 2011, Intel launched She Will, a campaign to educate and empower girls and women around the world by fostering equal economic and educational opportunities.
Intel has provided public reports on its environmental, health and safety performance since 1994 and produced an annual Corporate Responsibility Report since 2001. To read the new report, visit www.intel.com/go/responsibility. More information on Intel's corporate responsibility programs can be found at the CSR@Intel blog and on Twitter.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel is a trademark of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
1 Assuming a typical chip size of approximately 1 cm2 (chips vary in size depending on the specific product).
2 Data center energy efficiency is determined by server energy efficiency (as measured by SPECPower_ssj2008 or equivalent publications and using a 2010 baseline of an E56xx series processor-based server platform) as well as technology adoption that raises overall data center work output (such as virtualization technology). Notebook computer energy efficiency is determined by average battery life, battery capacity and number of recharge cycles of volume notebook computers in that model year.
Chip Shot: Maintaining Security in the Age of Oversharing -- Executive PerspectivesWednesday May 16th 2012 03:33:40 PM
As more personal information is shared online and more business transactions are made using technology, companies and consumers alike need to take security of their information and data into consideration. Leaders from McAfee, HP, MasterCard, and Ubiquisys discuss the technology behind protecting personal data and maintaining consumer privacy in a world where social sharing, and commonly oversharing, has become the norm. Visit Intel's 60 Second Insights for the latest executive perspectives.
Chip Shot: Intel Launches Employee-Curated Digital MagazineWednesday May 16th 2012 11:39:04 AM
“iQ by Intel,” launched today as a public beta, is a new publishing platform curated by researchers, engineers and visionaries at Intel. The site, at iQ.intel.com, is inspired by technology trends of how people discover and share content online. iQ is focused on the larger global impact of technology on our world. Specifically, it serves as a discovery tool that narrates technology’s influence and effect on “Media,” “Life” and our “Planet." It’s here to remind us of how fast we’re moving as a global culture, to be cognizant of how far we’ve come as humankind and to reflect on where our planet is headed in the 21st century. The iQ platform was created to spotlight how people are using technology in inspiring ways, and its mission is simple: Share and source content that inspires, educates, entertains and helps all of us to better understand our modern world.
Chip Shot: Intel® SCS Unlocks the Power of Intel® Core™ vPro™ TechnologyTuesday May 15th 2012 06:32:16 PM
Intel today announced its 3rd generation Intel® Core™ vPro™ processor platform that will deliver innovations in performance, security, and automation. As part of that announcement, the company also released the latest version of Intel® Setup and Configuration Software (Intel® SCS). Intel SCS allows organizations to discover, setup and configure, and establish a secure connection to every vPro managed device on its network. Click to learn more about how to use Intel SCS for unlocking the features and the value of systems with Intel Core vPro technology.
Chip Shot: Intel® Core™ vPro™ Strengthens Security, Boosts PerformanceTuesday May 15th 2012 01:33:40 PM
Today Intel announced its 3rd generation Intel® Core™ vPro™ processors based on Intel’s 22nm microarchitecture. Businesses can take advantage of the latest Intel Core vPro processors through a multitude of devices including Ultrabook™ devices, laptops, desktops, workstations and all-in-one PCs. In addition, the 3rd generation Intel Core vPro processors are poised to accelerate the move from isolated, fixed-function systems to intelligent systems in industrial, healthcare and retail sectors.
Chip Shot: Intel's Dr. Genevieve Bell Inducted into WITI Hall of FameTuesday May 15th 2012 12:45:08 PM
Dr. Genevieve Bell, director of user interaction and experience at Intel was named by WITI (Women In Technology International) as one of the the recipients of the 17th Annual WITI Hall of Fame Awards. The Women in Science and Technology Hall of Fame Awards are considered among the most illustrious honors for women in science and technology as noted by Rob Enderle, president and principal analyst of the Enderle Group.
Intel Strengthens Security, Boosts Performance for Business with 3rd Generation Intel® Core™ vPro™ PlatformsTuesday May 15th 2012 08:25:01 AM
NEWS HIGHLIGHTS
- The 3rd generation Intel® Core™ vPro™ processor platform provides businesses and intelligent system designs the security, performance and form factor improvements needed to compute with confidence.
- Embedded security features help businesses protect themselves in four ways: threat management, identity and access, data protection, and monitoring and remediation.
- Future Ultrabook™ devices built with the 3rd Generation Intel Core vPro processor platform are designed to bridge the gap between IT and business end users.
- Enhanced designs help accelerate the move from fixed function and disconnected systems to intelligent systems in retail, industrial and healthcare industries.
SANTA CLARA, Calif., May 15, 2012 - Today's IT managers face a range of challenges from complex business processes to sophisticated security threats. Additionally, a number of industries such as retail, healthcare and industrial are turning to technology to develop innovative solutions to solve the unique challenges facing them in an increasingly connected world. To address these challenges, Intel Corporation has announced the availability of its 3rd Generation Intel® Core™ vPro™ processor-based platforms for business and intelligent systems.
The enhancements to the Intel Core vPro processor platform provide a more secure platform for business computing and drive the next wave of innovation in intelligent systems. The Intel Core vPro processor-based platforms address the realities of today's business climate, where data integrity and organizational efficiency create a competitive advantage. New capabilities embed security at every layer, including the silicon, without compromising performance. Software innovation allows IT managers to set up and configure systems within minutes to quickly implement compelling solutions. Additionally, the enhanced graphics and secure manageability help accelerate the transition and growth in intelligent systems for the retail, industrial, and healthcare industries.
"With the 3rd generation Intel Core vPro processor platform, Intel is leading the way into a new era, delivering the comprehensive and manageable computing solutions to business that enable them to deal with security threats, while providing the flexibility and form factors users demand," said Rick Echevarria, vice president, Intel Architecture Group and general manager, Business Client Platform Division.
Businesses can take advantage of the latest Intel Core vPro processor platform through a multitude of devices including Ultrabook™ devices, laptops, desktops, workstations and all-in-one PCs.
Embedded Security
To defend against identity theft, Intel introduced Intel® Identity Protection Technology with public key infrastructure (Intel® IPT with PKI) into Intel Core vPro processors. The technology provides a new second layer of authentication embedded into the PC that allows websites and business networks to validate that a legitimate user is logging in from a trusted PC by using a private key stored in a PC's firmware. Intel has been working with solution providers and online Web properties such as Feitian, InfoSERVER, Symantec and VASCO to take advantage of Intel IPT technology to ultimately safeguard users' identity.
The latest version of the Intel Core vPro Processor platform also features Intel® OS Guard and Intel® Secure Key. Intel Secure Key, with Intel® AES New Instructions, protects media, data and assets from loss, while Intel OS Guard detects and prevents malware.
Strengthened security from the Intel Core vPro processor platform and McAfee* includes tools such as ePO Deep Command and allow for secure data exchange across increasingly connected ecosystems such as healthcare where doctor's offices share sensitive information with labs and hospitals.
Remote Management and Automation
The Intel Core vPro Processor family includes Intel® Active Management Technology (Intel® AMT) to remotely manage computing issues. Businesses in a range of industries can use Intel AMT to achieve power savings, remote management and inventory control. For example, retailers with point-of-sale machines, digital signs or other intelligent devices can remotely diagnose and quickly fix problems over their network so customer transactions are not interrupted and sales are not lost. With a typical IT service call averaging $200 in a retail environment, large-scale retailers can save millions of dollars in service calls with the ability to remotely manage thousands of systems using Intel AMT.
Industrial computing systems can also use 3rd generation Intel Core processors to consolidate multiple automation functions onto one platform so factories can achieve greater efficiencies in managing all devices and systems. Once all devices and systems are connected, factory managers can collect real-time data for decision making, diagnosis and predictive maintenance.
Intelligent Performance
The 3rd generation Intel Core vPro processors continue to enhance the computing experience in all areas, including the use of business intelligence and big data. The 3rd generation Intel Core vPro processors put greater performance in the hands of more information workers, giving them the ability to access and glean insights from all the information accumulating in their data banks, right on their PC. With the power to handle and manipulate this information faster, familiar PC tools such as Excel are evolving to support this process of creating, collaborating and sharing big data insights.
Additionally, the 3rd generation Intel Core vPro processor family drives significant improvements in compute performance as well as media and graphics capabilities for intelligent systems to meet the needs of compute-intensive applications in retail, industrial and healthcare industries. For example, the support for up to three independent displays makes it possible for a digital sign to drive more displays out of one system versus the previous-generation Intel Core processors. With Intel® Quick Sync Video and Intel® Clear Video HD Technology, medical diagnostic equipment can convert and process digital images and video streams faster, enabling delivery of smoother visuals for healthcare professionals to make timely and accurate diagnoses. The technology also enables end-to-end high definition video conferencing for business users.
The performance improvements also provide the processing power needed to run real-time analytics applications such as Intel® Audience Impression Metrics Suite (Intel® AIM Suite). Intel AIM Suite is an audience detection technology designed for digital signs and retail solutions that need instant metrics gathering to offer more targeted advertising and advanced measurement.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel, Intel Core vPro, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Chip Shot: Intel Celebrates 25 Years in Brazil at IDF Sao PauloTuesday May 15th 2012 01:12:22 AM
Celebrating 25 years in Brazil, Intel today held its Intel Developers Forum in Brazil, now the world’s third largest PC market after China and the US. The event included announcements of Banco do Brasil adopting Intel’s Identity Protection Technology for its online banking customers. In addition, Intel announced a public school initiative that will put Classmate Convertible PCs into the hands of over 160,000 Brazilian elementary school students. Intel first launched its Education Program in Brazil over a decade ago, and has since helped 500,000 students across 600 cities there.
Chip Shot: Intel Expands Channel Motherboard Portfolio with Value Oriented OfferingsMonday May 14th 2012 11:06:17 AM
Building on its commitment to deliver the industry’s most comprehensive lineup of channel ready motherboards, systems and chassis, Intel today announced an expanded offering for the just released Intel® Xeon® processor E5- 2400 product family. The offering includes four new motherboards spanning a range of entry level customer needs, from SMB to enterprise and the cloud. Read more here.
Intel Gives IT More Options with New Intel® Xeon® ProcessorsMonday May 14th 2012 10:57:39 AM
NEWS HIGHLIGHTS
- Three new Intel® Xeon® processor families address todays expanding business requirements, from high performance computing to simple web hosting.
- The Intel Xeon processor E5-4600 product family brings efficient performance into a four-socket server configuration for customers seeking additional performance, density and flexibility.
- The Intel Xeon processor E5-2400 product family makes the performance and reliability of two-socket servers more affordable for small and medium sized businesses.
- Intel Xeon processor E3-1200 v2 product family delivers improved performance per watt, data security for small businesses as well as professional-grade graphics for entry workstation customers
SANTA CLARA, Calif., May 14, 2012 –Intel Corporation today announced the expansion of the Intel® Xeon® processor portfolio with new products designed to address a broad and emerging set of server requirements and provide IT managers with additional choice and flexibility.
To offer a range of energy-efficient and affordable solutions for server and workstation customers, the company introduced twenty-eight processors across three product families: eight processors from the Intel® Xeon® processor E5-4600 product family and nine processors from the Intel® Xeon® processor E5-2400 product family designed to complement the already available Intel® Xeon® processor E5-2600 product family. The company also announced availability of eleven processors from the Intel® Xeon® processor E3-1200 v2 product family.
“Companies today are increasingly dependent upon Information Technology to deliver innovative products and services to customers,” said Boyd Davis, vice president and general manager of the Datacenter Infrastructure Group at Intel. “To satisfy the increasing diversity of IT needs and workloads, Intel is excited to offer additional processor options to enterprises of all sizes with the Intel Xeon processor E5-4600/2400 and E3-1200 v2 product families. Our new products feature the flexibility, value and performance that businesses demand in a market that is ever less tolerant of compromise. We are also continuing to drive momentum in the micro server market by introducing new lower power processors within the Intel Xeon processor E3-1200 v2 product family.”
New Density-Optimized Four-Socket and Cost-Optimized Dual-Socket Processors
The Intel Xeon processor E5-4600 product family offers the performance and energy efficiency benefits of the record-breaking Intel Xeon processor E5 family to allow higher density designs than available with previous 4-socket systems. With up to 32 cores and 48 DIMMs per system, these processors are ideal for a wide range of technical compute applications, such as scientific research and financial services, as well as dense four-socket solutions for communications infrastructure and rapidly growing markets such as China.
The Intel Xeon processor E5-4600 product family offers the performance and energy efficiency benefits of the record-breaking Intel Xeon processor E5 family to allow higher density designs than available with previous 4-socket systems. With up to 32 cores and 48 DIMMs per system, these processors are ideal for a wide range of technical compute applications, such as scientific research and financial services, as well as dense four-socket solutions for communications infrastructure and rapidly growing markets such as China.
These processors support all of the features of the Intel Xeon processor E5 family such as Intel® Advanced Vector Extensions, Intel® Integrated I/O, PCI Express* 3.0, Intel® Turbo Boost Technology 2.0 and Intel® Trusted Execution Technology (Intel® TXT). For traditional 2-socket server customers facing increasing data demands and a need to scale up for additional performance, the new 4-socket servers will open up new opportunities to realize significant total cost of ownership advantages. The Intel Xeon processor E5-4600 product family delivers up to 88 percent higher performance1 than a comparable Intel Xeon processor E5-2600 product family-based server and up to 3.8x2 the prior generation 2-socket Intel® Xeon® processor 5600 series-based server.
Similarly, for small and medium businesses looking to upgrade from a single-socket configuration to a dual-socket server, Intel Xeon processor E5-2400 product family delivers a strong balance of energy-efficient performance and affordability while supporting core features of the Intel Xeon processor E5 family. With up to 3x3 the performance and significantly more memory and I/O options, these processors enable higher system densities and easier management compared to a single-socket server solution.
New Processors for Small Business and High-Density Environments
Also introduced today, the Intel Xeon processor E3-1200 v2 product family is an entry-level server and workstation processor based on Intel’s leading 22-nanometer (nm) process technology. Built for the unique demands of small business customers who require technology that lets them rapidly respond to market conditions and maintain a competitive advantage, these processors deliver up to 32 percent greater energy efficient performance4 and PCI Express* 3.0 for higher I/O bandwidth compared to the previous generation. There are more reasons to move up to a server featuring the Intel Xeon processor E3-1200 v2 product family including up to 72 percent improved performance5, better security and reliability compared to the latest systems based on the 2nd Generation Intel® Core™ i3-2130 desktop processor. To address workstation customers running professional-grade 2-D and basic 3-D computer-aided drafting as well as entry-level media and entertainment applications, the new processors offer Intel® HD Graphics P4000, which delivers up to 2x faster media processing capabilities6 compared to the previous generation.
Also introduced today, the Intel Xeon processor E3-1200 v2 product family is an entry-level server and workstation processor based on Intel’s leading 22-nanometer (nm) process technology. Built for the unique demands of small business customers who require technology that lets them rapidly respond to market conditions and maintain a competitive advantage, these processors deliver up to 32 percent greater energy efficient performance4 and PCI Express* 3.0 for higher I/O bandwidth compared to the previous generation. There are more reasons to move up to a server featuring the Intel Xeon processor E3-1200 v2 product family including up to 72 percent improved performance5, better security and reliability compared to the latest systems based on the 2nd Generation Intel® Core™ i3-2130 desktop processor. To address workstation customers running professional-grade 2-D and basic 3-D computer-aided drafting as well as entry-level media and entertainment applications, the new processors offer Intel® HD Graphics P4000, which delivers up to 2x faster media processing capabilities6 compared to the previous generation.
Intel Continues To Drive Micro Server Momentum
The Intel Xeon processor E3-1200 v2 product family also features two low-power processors optimized for micro servers to address the needs of the emerging scale out datacenter workloads and usages. The Intel Xeon processor E3-1265L v2 based platform delivers up to 39 percent better performance per watt7 for simple front end web workloads compared to the previous generation. Intel is also introducing the Intel Xeon processor E3-1220L v2, the world’s lowest power Intel Xeon processor at 17W TDP for dense micro server designs for applications such as low end dedicated hosting and basic content delivery. Systems based on the SSI* Micro Module Server Specification, designed for the micro server segment, and this new Intel Xeon processor, deliver up to 3.6x better performance per rack and up to 1.6x better performance per watt over prior the generation processor using traditional rack servers8.
The Intel Xeon processor E3-1200 v2 product family also features two low-power processors optimized for micro servers to address the needs of the emerging scale out datacenter workloads and usages. The Intel Xeon processor E3-1265L v2 based platform delivers up to 39 percent better performance per watt7 for simple front end web workloads compared to the previous generation. Intel is also introducing the Intel Xeon processor E3-1220L v2, the world’s lowest power Intel Xeon processor at 17W TDP for dense micro server designs for applications such as low end dedicated hosting and basic content delivery. Systems based on the SSI* Micro Module Server Specification, designed for the micro server segment, and this new Intel Xeon processor, deliver up to 3.6x better performance per rack and up to 1.6x better performance per watt over prior the generation processor using traditional rack servers8.
Extensive Industry Support
Starting today, system manufacturers from around the world are expected to announce platforms based on the Intel Xeon processor E5-4600/2400 product families and the Intel Xeon processor E3-1200 v2 product family. These manufacturers include Acer*, Appro*, Asus*, Bull*, Cisco*, Dell*, Fujitsu*, HP*, Hitachi Data Systems*, Hauwei*, IBM*, Inspur*, Lenovo*, NEC*, Quanta*, SGI*, Sugon*, Supermicro*, Tyan* and Unisys*.
Starting today, system manufacturers from around the world are expected to announce platforms based on the Intel Xeon processor E5-4600/2400 product families and the Intel Xeon processor E3-1200 v2 product family. These manufacturers include Acer*, Appro*, Asus*, Bull*, Cisco*, Dell*, Fujitsu*, HP*, Hitachi Data Systems*, Hauwei*, IBM*, Inspur*, Lenovo*, NEC*, Quanta*, SGI*, Sugon*, Supermicro*, Tyan* and Unisys*.
Product and Pricing Information
In quantities of 1000, the Intel Xeon processor E5-4600 product family ranges in price from $551 to $3,616, Intel Xeon processor E5-2400 product family ranges from $188 to $1,440 and the Intel Xeon processor E3-1200 v2 product family ranges from $189 to $884. Complete pricing details can be found at http://www.intc.com/priceList.cfm. For more details on these new Intel Xeon processors, visit www.intel.com/xeon. For more details on world records and other claims, visit www.intel.com/performance/server/.
In quantities of 1000, the Intel Xeon processor E5-4600 product family ranges in price from $551 to $3,616, Intel Xeon processor E5-2400 product family ranges from $188 to $1,440 and the Intel Xeon processor E3-1200 v2 product family ranges from $189 to $884. Complete pricing details can be found at http://www.intc.com/priceList.cfm. For more details on these new Intel Xeon processors, visit www.intel.com/xeon. For more details on world records and other claims, visit www.intel.com/performance/server/.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
For more complete information about performance and benchmark results, visit Performance Test Disclosure
For more complete information about performance and benchmark results, visit Performance Test Disclosure
1 Server-side Java* Middleware: Java* middle-tier performance on SPECjbb*2005 benchmark
SPECjbb* is a trademark of the Standard Performance Evaluation Corp. (SPEC). See www.spec.org for more information. Up to 1.88x higher performance based on Intel internal assessment compared to Intel Xeon processor E5-2600 product family using Server-side Java* SPECjbb*2005 benchmark. Source: Intel SSG TR#1228. Baseline 2-socket populated Intel® C606 Chipset-based customer reference server using two Intel® Xeon® processors E5-2680 (8C, 20M Cache, 2.7GHz, 8.0GT/s Intel QPI), 32GB memory (8x 4GB DDR3-1600 DIMMs), Microsoft Windows Server* 2008R2 Enterprise Edition, Oracle HotSpot* 64-bit Server VM build 20,0-v11 using Java* SE RE 1.6.0 Update 25. Score: 1,418,557 bops. New 4-socket populated Intel® C606 Chipset-based customer reference server with four Intel® Xeon® processors E5-4650 (8C, 20M Cache, 2.7GHz, 8.0GT/s Intel QPI), 128GB memory (16x 8GB DDR3-1600 DIMMs), Microsoft Windows Server* 2008R2 Enterprise Edition, Oracle HotSpot* 64-bit Server VM build 20,0-v11 using Java* SE RE 1.6.0 Update 25. Score: 2,663,768 bops.
SPECjbb* is a trademark of the Standard Performance Evaluation Corp. (SPEC). See www.spec.org for more information. Up to 1.88x higher performance based on Intel internal assessment compared to Intel Xeon processor E5-2600 product family using Server-side Java* SPECjbb*2005 benchmark. Source: Intel SSG TR#1228. Baseline 2-socket populated Intel® C606 Chipset-based customer reference server using two Intel® Xeon® processors E5-2680 (8C, 20M Cache, 2.7GHz, 8.0GT/s Intel QPI), 32GB memory (8x 4GB DDR3-1600 DIMMs), Microsoft Windows Server* 2008R2 Enterprise Edition, Oracle HotSpot* 64-bit Server VM build 20,0-v11 using Java* SE RE 1.6.0 Update 25. Score: 1,418,557 bops. New 4-socket populated Intel® C606 Chipset-based customer reference server with four Intel® Xeon® processors E5-4650 (8C, 20M Cache, 2.7GHz, 8.0GT/s Intel QPI), 128GB memory (16x 8GB DDR3-1600 DIMMs), Microsoft Windows Server* 2008R2 Enterprise Edition, Oracle HotSpot* 64-bit Server VM build 20,0-v11 using Java* SE RE 1.6.0 Update 25. Score: 2,663,768 bops.
2 Up to 3.8x greater performance gains based on performance comparisons using best measured 2- and 4-socket server LINPACK MP benchmark results as of 1 March 2012. (Source: TR#1195). Baseline 1.0 – 2-socket server based on Intel Xeon processors X5690 (12M cache, 3.46GHz, 6.4GT/s Intel® QPI), 48GB memory (12x 4GB DDR3-1333). Score: 159.4 GFLOPS. Source: Intel SSG TR#1236.
New 4-socket server based on Intel Xeon processor E5-4650 (20M cache, 2.7GHz, 8.0GT/s Intel QPI), 64GB memory (16x 4GB DDR3-1600). Score: 602 GFLOPS. Source: Intel SSG TR#1264.
New 4-socket server based on Intel Xeon processor E5-4650 (20M cache, 2.7GHz, 8.0GT/s Intel QPI), 64GB memory (16x 4GB DDR3-1600). Score: 602 GFLOPS. Source: Intel SSG TR#1264.
3 Up to3X performance based on SPECjbb*2005 Configuration Details:
Intel Xeon processor E3-1280v2 score of 418,575 SPECjbb2005 bops based Intel® C206 chipset based platform with one Intel® Xeon® Processor E3-1280v2 (Quad-core, 3.6GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing TR1278 as of Mar 2012.
Intel Xeon processors E5-2470 score of 1,305,471 SPECjbb2005 bops based on Intel® C606 chipset-based platform with two Intel® Xeon® Processor E5-2470 (8-core 2.3GHz, 20M L3 cache, 8.0GT/s, 95W, C1-stepping), EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 48GB memory (3x 8GB DDR3-1600 RDIMM), 64GB SATA SSD, Windows 2008 R2 Enterprise. Java SE Runtime Environment (build 1.6.0_27-b07), Java HotSpot 64-Bit Server VM (build 20.2-b06, mixed mode). Source: Intel internal testing TR1230 as of Dec 2011.
Intel Xeon processor E3-1280v2 score of 418,575 SPECjbb2005 bops based Intel® C206 chipset based platform with one Intel® Xeon® Processor E3-1280v2 (Quad-core, 3.6GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing TR1278 as of Mar 2012.
Intel Xeon processors E5-2470 score of 1,305,471 SPECjbb2005 bops based on Intel® C606 chipset-based platform with two Intel® Xeon® Processor E5-2470 (8-core 2.3GHz, 20M L3 cache, 8.0GT/s, 95W, C1-stepping), EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 48GB memory (3x 8GB DDR3-1600 RDIMM), 64GB SATA SSD, Windows 2008 R2 Enterprise. Java SE Runtime Environment (build 1.6.0_27-b07), Java HotSpot 64-Bit Server VM (build 20.2-b06, mixed mode). Source: Intel internal testing TR1230 as of Dec 2011.
4 Up to 32% better energy efficient performance based on gen to gen comparison using SPECpower_ssj*2008. Details: SPECpower_ssj2008
Baseline Configuration and Score on Benchmark: Intel® C206 chipset CRB platform with one Intel® Xeon ® Processor E3-1280(Quad-Core, 3.5GHz, 8MB L3 cache), Turbo Boost Disabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64GB SATA SSD, Windows Server2008R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 2957.
New Configuration and Score on Benchmark: Intel® C206 chipset CRB platform with one Intel® Xeon® Processor E3-1280v2 (Quad-core, 3.6GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Disabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 3895.
Baseline Configuration and Score on Benchmark: Intel® C206 chipset CRB platform with one Intel® Xeon ® Processor E3-1280(Quad-Core, 3.5GHz, 8MB L3 cache), Turbo Boost Disabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64GB SATA SSD, Windows Server2008R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 2957.
New Configuration and Score on Benchmark: Intel® C206 chipset CRB platform with one Intel® Xeon® Processor E3-1280v2 (Quad-core, 3.6GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Disabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 3895.
5 Up to 72% better performance based on SPECint*_rate_base2006 comparison between Intel® Xeon® E3-1220V2 and Intel® Core™ processor i3-2130. Details: Baseline Configuration and Score on Benchmark: Intel® Core™ processor i3-2130, best published SPECint*_rate_base2006 score of 87.8 as of April 19, 2012.
http://www.spec.org./cpu2006/results/res2011q4/cpu2006-20111205-19118.html
New Configuration and Score on Benchmark: Intel® C206 chipset-based Platform with one Intel® Xeon® Processor Intel® Xeon® Processor E3-1220V2 (8M Cache, 3.10 GHz, E0 stepping), EIST Enabled, Turbo Boost enabled, Hyper-Threading Not supported, 16GB memory (2x 8GB DDR3-1600 ECC UDIMM), 160GB SATA 7200RPM HDD, Red Hat* Enterprise Linux Server 6.2 with kernel: 2.6.32-220.el6.x86_64. Compiler version: 12.1.0.225 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal testing estimates as of Feb 2012. Score: SPECint_rate_base2006=151
http://www.spec.org./cpu2006/results/res2011q4/cpu2006-20111205-19118.html
New Configuration and Score on Benchmark: Intel® C206 chipset-based Platform with one Intel® Xeon® Processor Intel® Xeon® Processor E3-1220V2 (8M Cache, 3.10 GHz, E0 stepping), EIST Enabled, Turbo Boost enabled, Hyper-Threading Not supported, 16GB memory (2x 8GB DDR3-1600 ECC UDIMM), 160GB SATA 7200RPM HDD, Red Hat* Enterprise Linux Server 6.2 with kernel: 2.6.32-220.el6.x86_64. Compiler version: 12.1.0.225 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal testing estimates as of Feb 2012. Score: SPECint_rate_base2006=151
6 Up to 2x faster media processing capabilities based on gen to gen comparison using 3DMarkVantage 1.2.0. Baseline Configuration and Score on Benchmark: Intel® Xeon® processor E3-1245 (4C/4T, 8MB Cache, 3.30 GHz), Intel® HD Graphics P3000, Motherboard: Intel® DZ68DB, BIOS DBZ6810H.86A.0032.2011.0928.1502, Memory Micron* 8 GB (2x4 GB) DDR3 1333. 3DMarkVantage 1.2.0 - 3DMark Score (Performance Preset @1280x1024) - 1773
New Configuration and Score on Benchmark: Intel® Xeon® processor E3-1245v2 (4C/4T, 8MB Cache, 3.40GHz), Intel® HD Graphics P4000, Motherboard: Intel® DZ77GA-70K, BIOS GAZ7710H.86A.1868.R06.1201060946, Memory Samsung* 8 GB (2x4 GB) DDR3 -1600. 3DMarkVantage 1.2.0 - 3DMark Score (Performance Preset @1280x1024) - 4085
New Configuration and Score on Benchmark: Intel® Xeon® processor E3-1245v2 (4C/4T, 8MB Cache, 3.40GHz), Intel® HD Graphics P4000, Motherboard: Intel® DZ77GA-70K, BIOS GAZ7710H.86A.1868.R06.1201060946, Memory Samsung* 8 GB (2x4 GB) DDR3 -1600. 3DMarkVantage 1.2.0 - 3DMark Score (Performance Preset @1280x1024) - 4085
7 Up to 39% better energy efficient performance based on gen to gen comparison using SPECpower_ssj*2008. Details:
Baseline Configuration and Score on Benchmark: Intel® C206 chipset based platform with one Intel® Xeon ® Processor E3-1260L (Quad-Core, 2.4GHz, 8MB L3 cache), EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64GB SATA SSD, Windows Server2008R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 3079.
New Configuration and Score on Benchmark: Intel® C206 chipset based platform with one Intel® Xeon® Processor E3-1265Lv2 (Quad-core, 2.5GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 4291.
Baseline Configuration and Score on Benchmark: Intel® C206 chipset based platform with one Intel® Xeon ® Processor E3-1260L (Quad-Core, 2.4GHz, 8MB L3 cache), EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64GB SATA SSD, Windows Server2008R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 3079.
New Configuration and Score on Benchmark: Intel® C206 chipset based platform with one Intel® Xeon® Processor E3-1265Lv2 (Quad-core, 2.5GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 4291.
8 Baseline configuration: Intel® Xeon® processor E3-1220L
Maximum number of nodes, 42U rack: 41 1U server + 1x 1U 48 port GbE Ethernet switch
Performance per node/rack: Best published SPECint*_rate_base2006 score of 69 as of April 26, 2012.
http://www.spec.org/cpu2006/results/res2012q1/cpu2006-20111219-19191.html. 41 servers = 2829
Power per node: Max power consumption of one Intel® Xeon® Processor E3-1220L on a Intel® C206 chipset-based platform using SPECpower_ssj2008, EIST Enabled, Turbo Boost Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: (ssj_ops@100%: 147,345, Power@100%: 50.1W, Active idle power: 25.4)
Power per rack: 2.3kW total. 1U switch = 240W, 41 1U server nodes = 2054W
Maximum number of nodes, 42U rack: 41 1U server + 1x 1U 48 port GbE Ethernet switch
Performance per node/rack: Best published SPECint*_rate_base2006 score of 69 as of April 26, 2012.
http://www.spec.org/cpu2006/results/res2012q1/cpu2006-20111219-19191.html. 41 servers = 2829
Power per node: Max power consumption of one Intel® Xeon® Processor E3-1220L on a Intel® C206 chipset-based platform using SPECpower_ssj2008, EIST Enabled, Turbo Boost Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: (ssj_ops@100%: 147,345, Power@100%: 50.1W, Active idle power: 25.4)
Power per rack: 2.3kW total. 1U switch = 240W, 41 1U server nodes = 2054W
Micro server Configuration: Intel® Xeon® Processor E3-1220Lv2
Maximum number of nodes: SSI rack= 10 3U chassis with 119 nodes + 3x 1U 48 port GbE switches
Performance per node/rack: Intel® C206 chipset-based platform with one Intel® Xeon® Processor E3-1220LV2 (3M Cache, 2.30 GHz, L1 stepping), EIST Enabled, Turbo Boost enabled, Hyper-Threading Enabled, 16GB memory (2x 8GB DDR3-1600 ECC UDIMM), 160GB SATA 7200RPM HDD, Red Hat* Enterprise Linux Server 6.2 with kernel: 2.6.32-220.el6.x86_64. Compiler version: 12.1.0.225 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal testing estimates as of Feb 2012. Score : SPECint_rate_base2006 of 85.7, 119 nodes = 10198.3
Power per node: Based on Intel estimates of 36W per node with one Intel® Xeon® Processor E3-1220Lv2 node, EIST Enabled, Turbo Boost Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 1x SSD, assuming shared cooling resources and shared power supplies
Power per rack: 5.0kW total. 3x 1U switches at 240W per switch = 720W, 119 nodes at 36W estimated per node = 4284W
Maximum number of nodes: SSI rack= 10 3U chassis with 119 nodes + 3x 1U 48 port GbE switches
Performance per node/rack: Intel® C206 chipset-based platform with one Intel® Xeon® Processor E3-1220LV2 (3M Cache, 2.30 GHz, L1 stepping), EIST Enabled, Turbo Boost enabled, Hyper-Threading Enabled, 16GB memory (2x 8GB DDR3-1600 ECC UDIMM), 160GB SATA 7200RPM HDD, Red Hat* Enterprise Linux Server 6.2 with kernel: 2.6.32-220.el6.x86_64. Compiler version: 12.1.0.225 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal testing estimates as of Feb 2012. Score : SPECint_rate_base2006 of 85.7, 119 nodes = 10198.3
Power per node: Based on Intel estimates of 36W per node with one Intel® Xeon® Processor E3-1220Lv2 node, EIST Enabled, Turbo Boost Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 1x SSD, assuming shared cooling resources and shared power supplies
Power per rack: 5.0kW total. 3x 1U switches at 240W per switch = 720W, 119 nodes at 36W estimated per node = 4284W
Chip Shot: Intel Expands Xeon Processors Portfolio with Three New Product FamiliesMonday May 14th 2012 10:05:38 AM
To offer a range of energy-efficient and affordable solutions for server and workstation customers, Intel introduced twenty-eight processors across three product families: Intel Xeon processors E5-4600 product family designed to bring efficient performance into a four-socket server configuration for customers seeking additional performance, density and flexibility; Intel Xeon processors E5-2400 product family to make the performance and reliability of two-socket servers more affordable for small and medium sized businesses; Intel Xeon processors E3-1200 v2 product family, first server processors based on 22nm Tri-Gate transistors, to deliver improved performance per watt, data security for small businesses or high-density environments and professional-grade graphics for entry workstation customers.
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